Heavy copper with 140um thickness High TG170 Immersion gold double-sided board manufacturer from China zitrok Electronics Co Ltd

Heavy copper with 140um thickness High TG170 Immersion gold double-sided board

Place of Origin:

Guangdong, China (Mainland)


	Add to My Favorites
HiSupplier Escrow	Share \|

Product Detail

Heavy copper with 140um thickness High TG170 Immersion gold double-sided board

Layer count: Rigid PCB 2 - 24 + Layers; Rigid-flex PCB 1 - 10Layers Panel Size(max): 21" x 24" for Rigid, 9.05'' x 47.2'' for FPC Materials: FR-4, roger, high-TG FR-4, halogen-free FR-4 Board thickness: 0.016" to 0.120" Copper weight: Heavy copper PCB (6oz finished) Finishing: hot air leveling/HASL(lead free),Immersion gold, immersion silver, gold fingers, carbon ink, OSP, peelable mask Minimum finishing hole size:0.006" Thru Hole (Finished Size) and 0.004" Buried Via, Hole Size Tolerance: ±0.05mm(PTH); ±0.05mm (NPTH) Aspect ratio: 10:01 Outline Dimension Tolerance: ±0.13mm Conductor Width Tolerance: ±0.05mm or ±20%of Original Artwork Warp & Twist Ratio: 0.70% Insulation Resistance For E/T test: 10K Ω-20M Ω Conductivity Resistance For E/T test: <50 Ω Voltage For E/T test: 300v maximum Registration Tolerance Front/Back Image: 0.075mm Layer to Layer Registration: 0.075mm Board Thickness Tolerance: ±8%(t≥1.0mm); ±0.1(t<1.0mm); Plugging hole Diameter with solder mask: 0.20mm-0.60mm Minimum Solder dam Width: 0.1mm Minimum Solder Mask Clearance: 0.05mm Solder Mask Type/Silkscreen Ink: LPI(green, white, black ,red ,etc) Outline profile: punching, routing, punch and push back Au thickness: 0.0762um-0.762um(Hard Au); 0.0254um-0.127um(Soft Au); Ni thickness: 2.032-7.362um http://www.zitrok-pcb.com

Layer count: Rigid PCB 2 - 24 + Layers; Rigid-flex PCB 1 - 10Layers
Panel Size(max): 21" x 24" for Rigid, 9.05'' x 47.2'' for FPC
Materials: FR-4, roger, high-TG FR-4, halogen-free FR-4
Board thickness: 0.016" to 0.120"
Copper weight: Heavy copper PCB (6oz finished)
Finishing: hot air leveling/HASL(lead free),Immersion gold, immersion silver,
gold fingers, carbon ink, OSP, peelable mask
Minimum finishing hole size:0.006" Thru Hole (Finished Size) and 0.004" Buried Via,
Hole Size Tolerance: ±0.05mm(PTH); ±0.05mm (NPTH)
Aspect ratio: 10:01
Outline Dimension Tolerance: ±0.13mm
Conductor Width Tolerance: ±0.05mm or ±20%of Original Artwork
Warp & Twist Ratio: 0.70%
Insulation Resistance For E/T test: 10K Ω-20M Ω
Conductivity Resistance For E/T test: <50 Ω
Voltage For E/T test: 300v maximum
Registration Tolerance Front/Back Image: 0.075mm
Layer to Layer Registration: 0.075mm
Board Thickness Tolerance: ±8%(t≥1.0mm); ±0.1(t<1.0mm);
Plugging hole Diameter with solder mask: 0.20mm-0.60mm
Minimum Solder dam Width: 0.1mm
Minimum Solder Mask Clearance: 0.05mm
Solder Mask Type/Silkscreen Ink: LPI(green, white, black ,red ,etc)
Outline profile: punching, routing, punch and push back
Au thickness: 0.0762um-0.762um(Hard Au); 0.0254um-0.127um(Soft Au);
Ni thickness: 2.032-7.362um
http://www.zitrok-pcb.com

style=�C-p��;HOas'> thickness: 2.032-7.362um
http://www.zitrok-pcb.com